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HL Series

HL-NS-355-30(M)-S

With the unique ‘cold processing advantage’ of UV light, it is widely used for cutting, drilling, marking and etching of materials in the high-end market of ultra-fine processing

Features

01

Modular design for easy upgrade and maintenance

02

TEM00 mode output

03

Adjustabl repetition rate

Applications

Solar Cell Process

PCB/FPC board marking, cutting and drilling

Ink removal, PVD layer removal

Scribing, cutting and drilling of ceramics

Wafer scribing

Sample Display

成品展示1.webp

stainless steel coloring

成品展示2.webp

PCB cutting

成品展示3.webp

Fireproof materials marking

成品展示1.webp

stainless steel coloring

成品展示2.webp

PCB cutting

成品展示3.webp

Fireproof materials marking

Parameters

HL-NS-355-30(M)-S
Output Characteristics
Wavelength355nm
Max Power30W@80kHz
Repetition Rate70kHz~200kHz
Pulse Width20ns-100ns
Pulse Energy Stability (rms)<3% rms@80kHz
Power Stability<2%rms
Beam Characteristics
Spatial ModeTEM00
Beam QualityM2<1.3
Polarization Ratio>100:1(horizontal)
Beam Diameter at Exit1.4mm±0.2mm
Divergence Full Angle (1/e²)<2mrad
Circularity>90%
Beam Pointing Stability≤±25μrad/℃
Working Conditions/Environmental Requirements
Power Supply36VDC±1V;≥600W switching power supply
Warm-up TimeStandby to ready<10 minutes; cold start to readiness < 30 minutes
Temperature Range15~30°C during working hours; 0~50°C during non-working hours
Humidity Range10~70% without condensation
Cooling RequirementsWater cooling, cooling capacity≥1000W, accuracy±0.1℃, flow rate≥10L/min
Physical Properties
Laser Dimensions698mm×214mm×165.9mm(L x W x H)
Laser Weight32kg